Die Per Wafer Calculator




Die Yield Calculator


Enter Die Dimensions (width, height) as well as scribe lane values (horizontal and vertical). Depending on the wafer diameter and edge Loss area, the maximum number of Dies and wafer map will be automatically updated. User can select Map centering (Die or wafer centered). The number of Good Dies will be as well calculated, using Murphy’s Low model of Die Yield and Defect density parameter.


PARAMETERS WAFER MAP
Die Width [w] (mm) 🔗
Die Height [h] (mm)
Horizontal Scribe Lane [sh] (mm) 🔗
Vertical Scribe Lane [sv] (mm)
Wafer Diameter (mm)
Edge Loss (mm)
Defect Density (#/sq.cm)
Manual wafer placement [horizontal shift]
Manual wafer placement [vertical shift]
Die Centering / Wafer Centering (check/uncheck)
Wafer Map Estimation using Murphy’s Model of Die Yield.




Print mapping © 2017 CALY Technologies.

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